| ITEM |
Description |
Cabability |
| Number of Layer |
|
1~6 (Rigid-Flex & Multilayer) |
| Min. Trace Width Min. Space |
Single Side |
0.05mm (2 mil) |
| Double Side |
0.05mm (2 mil) |
| Multi-layer |
0.05mm (2 mil) |
| Min. Hole Diameter |
CNC Drill |
0.1mm (4 mil) |
| Punching |
0.5mm (20 mil) |
| Surface Treatment |
Gold Plating |
0.025 µm-1.25 µm(1µ"-50µ") |
| soft ENIG |
0.025 µm-0.1 µm(1µ"-4µ") |
| Tin Plating |
60 µ"~500 µ" |
| Dimension Tolerances |
Conductor Width |
General±0.03 mm,Special±0.02 mm |
| Accumulated Pitch (Total Length≦30mm) |
General±0.05 mm,Special±0.03 mm |
| Outline Dimension |
General±0.1 mm,Special±0.05 mm |
| Outline Shift Tolerance |
General±0.1 mm,Special±0.07 mm |
| Apply Coverlay Tolerance |
General±0.3 mm,Special±0.15 mm |
| Hole Diameter |
±0.05 mm |
| Silkscreen printing |
General±0.5 mm,Special±0.3 mm |
| Stiffener Paste |
General±0.5 mm,Special±0.2 mm |
| Thickness Tolerances |
Silver Paste |
5-30 µm |
| Solder Mask |
5-20 µm |
| ACP Paste |
10-30 µm |
| ZIF Area |
General±0.05 mm,Special±0.03 mm |
| FPC Thickness |
General±0.05 mm,Special±0.03 mm |
| SMT Capability |
Connector Min Pitch |
Pitch 0.4 mm |
| Passive Component |
0201 |
| IC Bonding Min Pitch |
Pitch 40 um |
| Solder Heat Resistance |
300°C / 10 sec |
| Flammability |
|
UL- 94V-0 |
