Process Capabilities
FPC/ FPCA
FPC/FPCA
1~6L
Flexible Printed Circuit (FPC) can be bent, 3D folded, or even curled. It is suitable for electronic products that require space saving or dynamic flexing.
Characteristics of FPC Flexible circuits are recognized as a critical element in modern electronic product design, valued for their flexibility and high performance
Flexible
Capable of bending and folding to suit design needs, they offer superior design freedom and versatility.
Lightweight
Utilizing a thin film substrate, it offers reduced weight, making it ideal for lightweight and portable electronic devices
High Density
Capable of accommodating more complex circuit designs, it meets the demands of modern high-density electronic components.
Durability
With outstanding resistance to heat and chemicals, it is well-suited for demanding and harsh operating conditions.
PCB・PCBA
PCB/PCBA
1~2L
Thin rigid PCBs, commonly manufactured using FR4 (a combination of glass fiber and epoxy resin) as the base material, feature a thinner profile while maintaining the mechanical strength of standard rigid boards. They are ideal for electronic products requiring lightweight, high-density assembly — such as wearable devices and portable electronics. Their advantages include space efficiency, enhanced thermal management, and compatibility with precision circuit designs. It is suitable for electronic products that require lightweight and high-density assembly, such as wearable devices and mobile devices. Its advantages include saving space, improving heat dissipation efficiency and supporting fine circuit design.
Characteristics of thin PCB
Lightweight design
With a thickness lower than that of traditional rigid boards, thin rigid PCBs are ideal for applications demanding high-density integration and limited overall thickness
Enhanced heat dissipation capability
Despite its thin profile, it maintains the superior thermal management performance characteristic of rigid materials
FPC/PCB Manufacture Capabilities
| Item |
Description | Manufacture Capacities |
|---|---|---|
| Layers | FPC : 1~6 | 0.1~0.5mm (4~20 mil) |
| PCB : 1~2 | 0.15~0.5mm (6~20 mil) | |
| R-FPC : 3-6 | 0.4~1.0mm (16~40 mil) | |
| High frequency | Material | LCP、MPI、BT |
| Width / Space(Min.) | Single layer | 0.030 / 0.030 mm (1.2/1.2 mil) |
| Double / Mulitlayer | 0.035 / 0.035 mm (1.4/1.4 mil) | |
| Hole size(Min.) | CNC / Laser drilling | 0.1 / 0.03 mm (4/1.2 mil) |
| Stamping Tooling | 0.5mm (20 mil) | |
| PIC | Photo lmageable Coverlay(Low rebound force) | Yellow/ Black, Thickness 25 ~ 55 um, Tolerance ± 50 um |
| Metal Finish Surface treatment | Ni/Au plating | Au : 0.025~0.2µm(1-8µ”) / Ni : 1.5~20µm(50~500u”) |
| EN-IG | Au : 0.025~0.1µm(1-4µ”) / Ni : 1.5~9µm(50~350u”) | |
| ENEPIG |
Au : 0.05~0.15µm(2~6µ”) Pd : 0.05~0.15µm(2~6µ”) Ni : 1.5~20µm(50~500µ”) |
|
| Dimension& Tolerance | Trace width | Normal : ± 20 %,Min. : ± 10 % |
| Finger cumulative tolerance (length≦30mm) | Normal:±0.03 mm,Min.:±0.025 mm | |
| Finger Cumulative tolerance(length>30mm) |
Normal:±Total*10/10000 mm Min.:±Total*3/10000 mm |
|
| Min Ring | Normal:0.15mm,Min.:0.075mm | |
| Outline dimension | Normal:±0.1 mm,Min.:±0.05 mm | |
| Finger offset | Normal:±0.1 mm,Min.:±0.07 mm，CPK>1.67 | |
| CVL offset | Normal:±0.2 mm,Min.:±0.15 mm | |
| Printing tolerance | Normal:±0.3 mm,Min.:±0.25 mm | |
| Soldmask tolerance | ±0.015 mm | |
| Text ink printing | ±0.035 mm | |
| Stiffener pasting tolerance (PI, FR4, SUS) | Normal:±0.3 mm,Min.:±0.2 mm | |
| Adhesive accessories | ±0.1 mm | |
| Long size FPC | length dimension (single side) | ≦ 2,000 mm |
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SMT Capabilities
| Component
|
Manufacture Capacities |
Tolerance | ||
|---|---|---|---|---|
| Normal | Min. | Normal | Min | |
| Capacitor |
0201 (Metric 0603) (0.6*0.3mm) |
01005 (Metric 0402) (0.4*0.2mm) |
+/-0.05mm | +/-0.03mm |
| Resistor | ||||
| Inductor | ||||
| LED | ||||
| IC | Pitch 0.4mm | Pitch 0.25mm | ||
| BGA | ||||
| Connector | ||||
| Switch | ||||
| USB | Standard spec. | |||
| pogo pin | Pitch 3.0mm | Pitch 1.5mm | +/-0.1mm | +/-0.05mm |
| Dip | - | - | ||
| Remark |
1.Thickness 0.1~6mm 2.SMT product height Max less than 15mm 3.Inspection X-ray |
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