Integrated Solution
To ensure our partners receive the best quality and service, we’ve vertically integrated our operations to provide one-stop solutions, allowing customers to access dependable, high-quality products with ease.

Process Capabilities
Process Capabilities
What defines FPC process capabilities?
Flexible Printed Circuits (FPCs) offer thin, lightweight, and highly integrated solutions, making them essential components in modern electronics such as smartphones, wearables, automotive electronics, and medical devices.
Process capability showcases an FPC manufacturer’s overall competence in producing stable, top-quality products at scale.
Process capabilities extend beyond equipment, integrating design support, material selection, process control, and quality validation into a complete production solution.
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Process Overview
Process Overview
Flexible Printed Circuit Boards (FPCs), or soft boards, are produced by bonding a flexible copper foil substrate (FCCL) with a soft insulating layer using adhesive. After lamination and processes like etching, the necessary circuitry is created to transmit electronic signals.
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Reliability Test
Reliability Test
Reliability testing verifies that a product can consistently meet performance standards under specific conditions and within a defined timeframe through simulated operational testing.
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Since 1998, we’ve upheld a commitment to delivering premium FPC products and exceptional service to our partners.
Established on October 12, 1998, Sunflex is headquartered in Guishan District, Taoyuan City, Taiwan. The company focuses on the production and distribution of diverse types of flexible printed circuit boards.
The company’s product range utilizes key raw materials, including single-sided and double-sided copper foil, light-emitting diodes, transistors, resistors, capacitors, connectors, adhesives, thermosetting compounds, cover films, and other essential components.
Market Segments
The company’s product range utilizes key raw materials, including single-sided and double-sided copper foil, light-emitting diodes, transistors, resistors, capacitors, connectors, adhesives, thermosetting compounds, cover films, and other essential components.
Locations
8
個工廠、子公司與辦事處
Clients
150
間國際企業
FPC Capabilities
6
Layers

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At Sunflex, we invite driven and creative design professionals to join our family — to build value together and celebrate shared success.
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